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Lenovo 4ZC7A08707 16GB DDR4 2933MHz Memory Module (16GB, 1X16GB, DDR4, 2933MHz, RDIMM)

Lenovo 4ZC7A08707 16GB DDR4 2933MHz Memory Module (16GB, 1X16GB, DDR4, 2933MHz, RDIMM)

Brand: Lenovo

Features:

  • Lenovo 4ZC7A08707 Component for: PC/server.
  • Internal memory: 16 GB.
  • Memory arrangement (modules x sizes): 1 x 16 GB.
  • Internal memory type: DDR4
  • Memory frequency: 2933 MHz.
  • Memory support: RDIMM

Publisher: Lenovo

Details: ThinkSystem TruDDR4 Memory delivers trusted, tested, quality, performance, and reliability throughout the ThinkSystem portfolio. We use the highest quality industry-standard memory components sourced from Tier 1 DRAM suppliers. Only memory that meets these strict requirements are selected for TruDDR4 Memory. It is then compatibility tested and tuned on every ThinkSystem server to maximize reliability. In addition, TruDDR4 Memory DIMMs have a unique signature programmed into them so your system can verify that TruDDR4 Memory is installed in your system. Since the memory will be authenticated, memory stretch goals are enabled only when TruDDR4 Memory DIMMs are detected. Together with lower power consumption, these new DIMMs can provide the lowest TCO for data centers. High Performance Memory Lenovo offers high-performance and high-capacity memory options in ThinkSystem servers. Persistent Memory Lenovo ThinkSystem servers configured with Intel Optane DC Persistent Memory transforms the memory/storage hierarchy enabling faster insights from data. This breakthrough technology delivers large capacity, high speed, affordable memory with data persistence and advanced encryption capabilities. These DDR4 compatible modules significantly increase the capacity of available system memory, keeping more hot data closer to the CPU, and enabling greater operational efficiency by processing larger data sets with more user instances. 3DS RDIMMs To meet the ever increasing demand for higher density server memory modules, Lenovo offers 3DS (3 Dimensional Stacked) DDR4 RDIMMs which apply TSV (Through Silicon Via) technology from our partnership with a leading Tier 1 DRAM supplier. The new TSV 3DS stack technology enables higher density DRAM stack packages with higher operational frequency and reduced power consumption. The RDIMM configuration along with 3DS TSV DRAM packages exhibits perf

UPC: 889488486397

EAN: 889488486397

Package Dimensions: 2.0 x 1.0 x 1.0 inches

Item Condition: New

MPN: 4ZC7A08707

SKU: ING-1007ZW

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